Test method for semiconductor components using anisotropic conductive polymer contact system

ABSTRACT

A contact system for electrically engaging semiconductor components includes an interface board mountable to an automated test handler, and a floating substrate on the interface board. The interface board includes interface contacts in electrical communication with external test circuitry. The substrate includes flexible segments, and contactors having contact pads on opposing sides of the flexible segments configured to simultaneously electrically engage terminal contacts on the components, and the interface contacts on the interface board. The contact pads include conductive polymer layers that provide an increased compliancy for the contactors. This increased compliancy allows the contactors to accommodate variations in the dimensions and planarity of the terminal contacts on the component. In addition, the substrate includes grooves between the contactors which provide electrical isolation and allow the contactors to move independently of one another. An alternate embodiment contact system includes a Z-axis conductive polymer layer between the substrate and the interface board. Also provided are test methods employing the contact systems.

FIELD OF THE INVENTION

This invention relates generally to the testing and assembly ofsemiconductor components, such as semiconductor packages, BGA devicesand modules. More particularly, this invention relates to a conductivepolymer contact system for electrically engaging semiconductorcomponents, and to a test method employing the contact system.

BACKGROUND OF THE INVENTION

Semiconductor components, such as packages, BGA devices and modules,include terminal contacts in electrical communication with theintegrated circuits and electronic devices contained on the components.For example, the terminal contacts on semiconductor packages can be inthe form of leads, such as j-leads, gull wing leads, butt joint leads,or integral standoff leads. The terminal contacts on BGA devices andchip scale packages can be in the form of bumps, such as balls in a gridarray (BGA). As another example, the terminal contacts on electronicmodules, such as memory modules, can be in the form of pads, oralternately pins in a grid array (PGA).

In general, the terminal contacts on the components must be electricallyengaged during, and following manufacture of the components. Forexample, for testing the components, temporary electrical connectionsare made with the terminal contacts, and test signals are transmittedthrough the terminal contacts. Test systems for testing semiconductorcomponents include test boards and test circuitry in electricalcommunication with the test boards. The test boards can includeinterface boards having contactors configured to make temporaryelectrical connections with the terminal contacts on the components.Representative contactors include sockets, contact sets, and “POGOPINS”.

In these test systems it is advantageous to make temporary electricalconnections with the terminal contacts on the components that arereliable, and have low electrical resistance. This requires that theterminal contacts be scrubbed, or alternately penetrated by thecontactors, such that oxide layers and surface contaminants on theterminal contacts do not adversely affect the temporary electricalconnections. It is also advantageous for the contactors to accommodatevariations in the height and planarity of the terminal contacts. Thisrequires that the contactors have a compliancy or flexibility in makingthe temporary electrical connections. It is also advantageous for thecontactors to be inexpensive to make and to maintain, and inexpensive toreplace.

The contact system of the present invention includes contactorsconfigured to make reliable, low resistance, temporary electricalconnections with terminal contacts on semiconductor components. Thecontactors have an increased compliancy for accommodating variations inthe size and planarity of the terminal contacts. The contactors are alsoconfigured to provide increased durability and wear resistance in aproduction environment. Further, the contact system can be volumemanufactured at a low cost, permitting worn contactors to be easilyreplaced and discarded.

SUMMARY OF THE INVENTION

In accordance with the present invention, a contact system forelectrically engaging semiconductor components, and a test method fortesting semiconductor components, are provided. In illustrativeembodiments, the contact system is configured to electrically engagecomponents having terminal contacts in the form of leads, bumps or pads.In addition, the contact system and the test method are illustrated inthe testing of semiconductor packages, BGA devices and modules.

In a first embodiment, the contact system includes an interface boardhaving interface contacts in electrical communication with externalcircuitry (e.g., test circuitry). The contact system also includes asubstrate on the interface board. The substrate is configured to floaton the interface board, and is restrained by guide pins, fasteners, or alatching mechanism. The substrate preferably comprises a flexible,electrically insulating organic material, such as a glass filled resin(e.g., FR-4).

The substrate includes a pattern of contactors configured tosimultaneously electrically engage the terminal contacts on thecomponent, and the interface contacts on the interface board. Thecontactors include first contact pads on a first side of the substrate,and second contact pads on an opposing second side of the substrate. Thecontactors also include conductive vias electrically connecting thefirst contact pads to the second contact pads. The contact padspreferably comprise a non-oxidizing metal, such as gold or platinum,covered with a conductive polymer layer, such as silver filled epoxy.The first contact pads, and the conductive polymer layers thereon, areconfigured to electrically engage the terminal contacts on thecomponent. The second contact pads, and the conductive polymer layersthereon, are configured to electrically engage the interface contacts onthe interface board. The substrate also includes grooves (e.g., sawcuts) between the contactors, which form flexible segments for thecontactors, and provide electrical isolation for the contactors.

With the contact system, the terminal contacts on the component arealigned with, and then placed on the first contact pads. The componentis then pressed against the substrate using a suitable mechanism, suchas a test handler. The conductive polymer layers on the first contactpads electrically engage the terminal contacts on the component, withthe conductive particles therein (e.g., silver particles) penetratingoxide layers on the terminal contacts. Similarly, the conductive polymerlayers on the second contact pads electrically engage the interfacecontacts on the interface board. The resiliency of the conductivepolymer layers, along with the flexibility of the substrate and theflexible segments, provide an increased compliancy for the contactors.This increased compliancy allows the contactors to accommodatevariations in the dimensions and planarity of the terminal contacts onthe component.

In a second embodiment, the contact system again includes an interfaceboard having interface contacts in electrical communication withexternal circuitry (e.g., test circuitry). The contact system alsoincludes a substrate on the interface board. As with the firstembodiment, the substrate is configured to float on the interface board,and is restrained by guide pins, fasteners, or a latching mechanism. Inaddition, the substrate includes a pattern of contactors configured tosimultaneously electrically engage the terminal contacts on thecomponent, and the interface contacts on the interface board.

As with the first embodiment, the contactors include contact pads on afirst side of the substrate, second contact pads on an opposing secondside of the substrate, and conductive vias electrically connecting thefirst contact pads to the second contact pads. The first contact padsare configured to electrically engage the terminal contacts on thecomponent. The second contact pads are configured to electrically engagethe interface contacts on the interface board. However in the secondembodiment, an anisotropic conductive polymer layer on the second sideof the substrate provides Z-axis conductive paths between the secondcontact pads and the interface contacts on the interface board. Inaddition, the substrate again includes slots (e.g., saw cuts) betweenthe contactors, which form flexible segments on the substrate, andprovide electrical isolation for the contactors.

A test method performed with the first embodiment contact systemincludes the steps of: providing an interface board comprising aplurality of interface contacts in electrical communication with testcircuitry; providing a floating substrate on the interface board;providing a plurality of movable test contactors on the substratecomprising first contact pads with conductive polymer layers thereonconfigured to electrically engage the terminal contacts and secondcontact pads with conductive polymer layers thereon in electricalcommunication with the first contact pads and configured to electricallyengage the interface contacts; placing the component on the substratewith the terminal contacts in electrical communication with the firstcontact pads and the interface contacts in electrical communication withthe second contact pads; and applying test signals through the testcontactors and the terminal contacts to the component.

A test method performed with the second embodiment contact systemincludes the steps of: providing an interface board comprising aplurality of interface contacts in electrical communication with testcircuitry; providing a floating substrate on the interface board;providing a plurality of movable test contactors on the substratecomprising first contact pads configured to electrically engage theterminal contacts and second contact pads in electrical communicationwith the first contact pads and with an anisotropic conductive polymerlayer configured to electrically engage the interface contacts; placingthe component on the substrate with the terminal contacts in electricalcommunication with the first contact pads and the interface contacts inelectrical communication with the second contact pads; and applying testsignals through the test contactors and the terminal contacts to thecomponent.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a plan view of a prior art semiconductor component (package)suitable for use with the contact system of the invention;

FIG. 1B is a end elevation view of FIG. 1A;

FIG. 1C is an enlarged view taken along line 1C of FIG. 1B illustratinga terminal contact (gull wing lead) on the component;

FIG. 1D is an enlarged view equivalent to FIG. 1C illustrating analternate embodiment prior art terminal contact (integral standofflead);

FIG. 1E is an enlarged view equivalent to FIG. 1C illustrating analternate embodiment prior art terminal contact (j-bend lead);

FIG. 1F is an enlarged view equivalent to FIG. 1C illustrating analternate embodiment prior art terminal contact (butt joint lead);

FIG. 1G is a side elevation view of a prior art semiconductor component(BGA device or chip scale package) suitable for use with the contactsystem of the invention;

FIG. 1H is a bottom view of the component of FIG. 1G taken along line1H-1H;

FIG. 1I is a bottom view of a prior art semiconductor component (module)suitable for use with the contact system of the invention;

FIG. 2A is an end elevation view of a first embodiment conductivepolymer contact system constructed in accordance with the invention;

FIG. 2B is a cross sectional view taken along section line 2B-2B of FIG.2A;

FIG. 2C is an enlarged view taken along line 2C of FIG. 2A;

FIG. 2D is a plan view taken along line 2D-2D of FIG. 2A;

FIG. 2E is an enlarged side view taken along line 2E-2E of FIG. 2B;

FIG. 2F is an enlarged cross sectional view taken along section line2F-2F of FIG. 2C;

FIG. 2G is an enlarged cross sectional view taken along line 2G of FIG.2F;

FIG. 2H is an enlarged side elevation view equivalent to FIG. 2E of analternate embodiment contactor for bumped terminal contacts;

FIG. 2I is an enlarged side elevation view equivalent to FIG. 2E of analternate embodiment contactor for planar terminal contacts;

FIG. 3A is an end elevation view of a second embodiment conductivepolymer contact system constructed in accordance with the invention;

FIG. 3B is an enlarged view taken along line 3B of FIG. 3A;

FIG. 3C is a cross sectional view taken along section line 3C-3C of FIG.3A; and

FIG. 3D is an enlarged cross sectional view taken along section line3D-3D of FIG. 3B.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Referring to FIGS. 1A-1J, various prior art semiconductor componentssuitable for use with a contact system constructed in accordance theinvention are illustrated. As used herein the term semiconductorcomponent refers to an element that includes a semiconductor die havingintegrated circuits and semiconductor devices thereon.

In FIGS. 1A-1C, a semiconductor component 10A comprises a conventionalplastic semiconductor package having terminal contacts 12A in the formof metal leads. More specifically, the component 10A has theconfiguration of a thin small outline package (TSOP), and the terminalcontacts 12A have a gull wing configuration.

Alternately, the component 10A can have the configuration of anyconventional semiconductor package including quad flat pack (OFP), dualin line package (DIP), zig zag in line package (ZIP), small outlinej-bend (SOJ), and leadless chip carrier (LCC). Other exemplaryconfigurations for the terminal contacts 12A include integral standoffleads 12A-1 (FIG. 1D), J-bend leads 12A-2 (FIG. 1E) and butt joint leads12A-3 (FIG. 1F). Alternately the terminal contacts 12A can be in theform of bumps, balls, pads or pins.

In FIGS. 1G and 1H, a semiconductor component 10B comprises aconventional ceramic package, chip scale package or grid array devicehaving bumped terminal contacts 12B in the form of metal balls, bumps orpins in a dense grid array (e.g., BGA, FBGA, PGA). In FIG. 1I, asemiconductor component 10C comprises a module having planar terminalcontacts 12C in the form of planar pads in a grid array (PGA).

Referring to FIGS. 2A-2G, a contact system 16 constructed in accordancewith the invention is illustrated. The contact system 16 is configuredto test the component 10A with the terminal leads 12A. However, it is tobe understood that the contact system 16 can be configured forelectrically engaging any of the previously described semiconductorcomponents.

The contact system 16 includes an interface board 18, which isconfigured for mounting to an automated or manual test handler 14. Thetest handler 14 is schematically represented by a block in FIG. 2A.Support, movement and indexing of the component 10A can be provided bythe test handler 14. Suitable automated test handlers are commerciallyavailable from Advantest Corporation, Tokyo, Japan, as well as othermanufacturers.

The interface board 18 comprises an electrically insulating material,such as molded plastic, a glass filled resin (e.g., FR-4) or a ceramic.In addition, the interface board 18 includes a pattern of interfacecontacts 20 in electrical communication with test circuitry 22. The testcircuitry 22 is configured to generate and apply test signals to theintegrated circuits contained on the component 10A, and to analyze theresultant signals. Suitable test circuitry is commercially availablefrom Advantest Corporation of Tokyo, Japan, and Teradyne of Boston,Mass., as well as other manufacturers.

The interface contacts 20 can be formed in a pattern (size and spacing)that matches a pattern of the terminal contacts 12A on the component10A. The interface contacts 20 can comprise a highly conductive metal,such as copper or aluminum. In addition, the interface board 18 caninclude conductors 24, such as conductive traces, and metal filled viasthat electrically connect the interface contacts 20 to the testcircuitry 22.

In addition to the interface board 18, the contact system 16 alsoincludes a substrate 26 on the interface board 18. The substrate 26 isconfigured to float on the interface board 18, and is restrained byguide pins 28 (FIG. 2B) attached to the interface board 18. Openings 30(FIG. 2B) in the substrate 26 are sized to allow free sliding movementof the substrate 26 on the interface board 18 in the Z-direction. At thesame time, the openings 30 (FIG. 2B) have an inside diameter that isonly slightly larger than the outside diameter of the guide pins 28(e.g., one to several mils), such that the substrate 26 is accuratelylocated in the X and Y directions on the interface board 18.Alternately, in place of the guide pins 28, fasteners, or a latchingmechanism can be used to restrain the substrate 26 on the interfaceboard 18.

The substrate 26 preferably comprises a flexible, electricallyinsulating organic material, such as a glass filled resin (e.g., FR-4).In addition, the substrate 26 includes a pattern of contactors 32configured to simultaneously electrically engage the terminal contacts12A on the component 10A, and the interface contacts 20 on the interfaceboard 18. The substrate 26 also includes grooves 52, such as saw cuts,that electrically isolate the contactors 32 from one another. Inaddition, the grooves increase the flexibility, or compliancy of thecontactors 32.

As shown in FIG. 2C, the contactors 32 include first contact pads 34 ona first side 36 of the substrate 26, and second contact pads 38 on anopposing second side 40 of the substrate 26. The contact pads 34, 38preferably comprise a non-oxidizing metal, such as gold or platinum. Asshown in FIG. 2F, the contactors 32 also include conductive vias 42which electrically connect the first contact pads 34 to the secondcontact pads 38. The pattern of the first contact pads 34 exactlymatches the pattern of the terminal contacts 12A on the component 10A.In addition, although the first contact pads 34 and the second contactpads 38 are shown as having matching patterns, the second contact pads38 can be offset, or “fanned out” from the contact pads 34. In this casethe interface contacts 20 on the interface board 18 would also beoffset, or fanned out, with respect to the first contact pads 34.

The first contact pads 34 include a first conductive polymer layer 44,and the second contact pads 38 include a second conductive polymer layer46. As shown in FIG. 2G, the conductive polymer layers 44, 46 comprisesan elastomeric matrix material 48 having conductive particles 50A, orconductive particles 50B embedded therein. Suitable elastomeric matrixmaterials 48 include epoxy, silicone, natural rubber, synthetic rubber,and similar elastomeric materials having suitable compressive andadhesive characteristics.

As also shown in FIG. 2G, the conductive particles 50A compriseelectrically conductive metal particles, such as silver, in a sliverconfiguration. The conductive particles 50B comprise dendritic metalparticles, such as silver, in a crystal, or snow flake, configuration.Although the conductive polymer layers 44, 46 are illustrated asincluding both types of conductive particles 50A, 50B, it is to beunderstood that the conductive polymer layers 44, 46 can include eithertype of conductive particle 50A, 50B. In either case the conductiveparticles 50A, 50B are configured to provide an isotropic electricallyconductive path through the elastomeric matrix material 48 (e.g.,electrically conductive in all directions). In addition, the conductiveparticles 50A, 50B function to penetrate oxide layers on the terminalcontacts 12A, and on the interface contacts 20 such that low resistanceelectrical connections are made with the component 10A and the interfaceboard 18.

The conductive polymer layers 44, 46 can comprise a conventionalcommercially available composition. Suitable conductive polymers arecommercially available from different manufacturers including ShinetsuChemical Co., Japan; EPI Technologies, Richardson Tex.; A.I. Technology,Trenton N.J.; and Sheldahl, Northfield, Minn.

The conductive polymer layer 44, 46 can be deposited on the contactspads 34, 38 using a deposition process. Exemplary deposition methodsinclude screen printing and stenciling. With screen printing a stainlesssteel or monofilament polyester screen can be stretched and attached toa metal frame. A negative pattern can then be generated on the meshusing a photosensitive emulsion. The conductive polymer material canthen be forced through the screen and onto the first contact pads 34 orthe second contact pads 38. To facilitate the screen printing processthe conductive polymer material can be in a liquid or viscous conditionand then cured such as by outgassing a solvent. Another exemplarydeposition method for the bumps comprises deposition of the conductivepolymer material using a positive displacement dispensing mechanism,such as a syringe or screw dispenser apparatus.

As shown in FIG. 2E, the conductive polymer layers 44, 46 have a naturalresiliency that provides compliancy or compressibility for thecontactors 32 in the Z direction. In addition, the grooves 52 in thesubstrate 26 locate each contactor 32 on a separate flexible segment 54of the substrate 26. The compliancy of the conductive polymer layers 44,46 and the flexibility of the substrate 26 and the flexible segments 54thereon, allow the contactors 32 to compress and move independently ofone another to accommodate variations in the height and planarity of theterminal contacts 12A on the component 10A. In addition, the component10A can be overdriven by the test handler 14 (FIG. 2A) with a force F(FIG. 2A) into the contactors 32 to take advantage of the compliancy andflexibility of the contactors 32.

As shown in FIG. 2D, during a test process, the component 10A is placedon the substrate 26 with the terminal contacts 12A aligned with thecontactors 32. The test handler 14 (FIG. 2A) aligns and places thecomponent 10A on the substrate 26. Under the force F applied by the testhandler 14, the component 10A is pressed against the substrate 26, suchthat the terminal contacts 12A electrically engage the first contactpads 34 and the first conductive polymer layers 44 thereon. At the sametime, the second contact pads 38 (FIG. 2F) and the conductive polymerlayers 46 (FIG. 2F) thereon electrically engage the interface contacts20 on the interface board 18. This establishes electrical communicationbetween the test circuitry 22 (FIG. 2A) and the component 10A such thattest signals can be applied to the component 10A.

FIG. 2H illustrates an alternate embodiment contactor 32B configured toelectrically engage bumped terminal contacts 12B on the component 10B(FIG. 1G). The contactor 32B is constructed substantially similar to thepreviously described contactor 32, but includes a first conductivepolymer layer 32B having an indentation 56 configured to retain thebumped terminal contact 12B.

FIG. 2I illustrates an alternate embodiment contactor 32C configured toelectrically engage planar terminal contacts 12C on the component 10C(FIG. 1I). The contactor 32C is constructed substantially similar to thepreviously described contactor 32, but includes a first conductivepolymer layer 32C having a bump 58 configured to engage the planarterminal contact 12C.

Referring to FIGS. 3A-3D, a second embodiment contact system 16Aconstructed in accordance with the invention is illustrated. The contactsystem 16A includes an interface board 18A, which is configured formounting to an automated or manual test handler 14, as previouslydescribed.

The interface board 18A comprises an electrically insulating material,such as molded plastic, a glass filled resin (e.g., FR-4) or a ceramic.In addition, the interface board 18A includes a pattern of interfacecontacts 20A in electrical communication with test circuitry 22A.Further, the interface board 18A can include conductors 24A, such asconductive traces, and metal filled vias that electrically connect theinterface contacts 20A to the test circuitry 22A.

In addition to the interface board 18A, the contact system 16A alsoincludes a substrate 26A on the interface board 18A. As with theprevious embodiment, the substrate 26A is configured to float on theinterface board 18A on guide pins 28A (FIG. 3C) placed through openings30A. In addition, the substrate 26A preferably comprises a flexible,electrically insulating organic material, such as a glass filled resin(e.g., FR-4).

The substrate 26A includes a pattern of contactors 32A configured tosimultaneously electrically engage the terminal contacts 12A on thecomponent 10A, and the interface contacts 20A on the interface board18A. The substrate 26A also includes grooves 52A, such as saw cuts, thatelectrically isolate the contactors 32A from one another. In addition,the grooves 52A increase the flexibility, or compliancy of thecontactors 32A and form flexible segments 54A as previously described.

As shown in FIG. 3B, the contactors 32A include first contact pads 34Aon a first side 36A of the substrate 26A, and second contact pads 38A onan opposing second side 40A of the substrate 26A. The contact pads 34A,38A preferably comprise a non-oxidizing metal, such as gold or platinum.As shown in FIG. 3D, the contactors 32A also include conductive vias 42Awhich electrically connect the first contact pads 34A to the secondcontact pads 38A. The pattern of the first contact pads 34A exactlymatches the pattern of the terminal contacts 12A on the component 10A.In addition, although the first contact pads 34A and the second contactpads 38A are shown as having matching patterns, the second contact pads38A can be offset, or “fanned out” from the contact pads 34A. In thiscase the interface contacts 20A on the interface board 18 would also beoffset, or fanned out, with respect to the first contact pads 34A.

The contact system 16A also includes a Z-axis anisotropic conductivepolymer layer 60 between the substrate 26A and the interface board 18A.The Z-axis anisotropic conductive polymer layer 60 electrically connectsthe second contact pads 38A on the substrate 26A to the interfacecontacts 20A on the interface board 18A. Stated different, the Z-axisanisotropic conductive polymer layer 60 provides electrical conductivityin the Z direction. In addition, the Z-axis anisotropic conductivepolymer layer 60 provides electrical isolation in the X and Ydirections.

As with the previously described conductive polymer layers, the Z-axisanisotropic conductive polymer layer 60 can include conductive particlesin flake or dendrite form. However, in this case the conductiveparticles are configured to provide anisotropic conductivity (i.e.,conductivity in the Z direction, electrical isolation in the X and Ydirections). Suitable Z-axis anisotropic conductive polymers arecommercially available from different manufacturers including ShinetsuChemical Co., Japan; EPI Technologies, Richardson Tex.; A.I. Technology,Trenton, N.J.; and Sheldahl, Northfield, Minn.

The contact system 16A can be used to test the component 10Asubstantially as previously described for contact system 16. Inaddition, the contact system 16A can be configured to electricallyengage different types of terminal contacts on different types ofcomponents substantially as previously described.

Thus the invention provides a contact system, a contactor, and a testmethod for semiconductor components. Although the invention has beendescribed with reference to certain preferred embodiments, as will beapparent to those skilled in the art, certain changes and modificationscan be made without departing from the scope of the invention, asdefined by the following claims.

1-60. (canceled)
 61. A method for testing a semiconductor componenthaving a plurality of terminal contacts comprising: providing a boardcomprising a plurality of contacts in electrical communication with testcircuitry; providing a substrate on the board; providing a plurality ofmovable test contactors on the substrate comprising first contactsconfigured to electrically engage the terminal contacts and secondcontacts in electrical communication with the first contacts, and ananisotropic conductive polymer layer configured to electrically engagethe second contacts and the contacts; placing the component on thesubstrate with the terminal contacts in electrical communication withthe first contacts and the second contacts in electrical communicationwith the contacts; and applying test signals through the test contactorsand the terminal contacts to the component.
 62. The method of claim 61wherein the substrate comprises a plurality of grooves separating thecontactors and forming flexible segments for the contactors.
 63. Themethod of claim 61 further comprising applying a force to the componentduring the placing step.
 64. The method of claim 61 wherein thesubstrate is configured to float on the board.
 65. The method of claim61 wherein the terminal contacts comprise an element selected from thegroup consisting of leads, bumps and pads.
 66. The method of claim 61wherein the placing step is performed using a test handler.
 67. A methodfor testing a semiconductor component having a terminal contactcomprising: providing a board comprising at least one contact inelectrical communication with test circuitry; providing a substrate onthe board comprising at least one contactor configured to simultaneouslyelectrically engage the contact and the terminal contact, the contactorcomprising a first contact on a first side of the substrate configuredto electrically engage the terminal contact, a second contact on thesecond side in electrical communication with the first contact, and ananisotropic conductive polymer layer proximate to a second opposing sideof the substrate configured to electrically engage the second contactand the contact; placing the component on the board with the firstcontact in electrical communication with the terminal contact and thesecond contact in electrical communication with the contact; andapplying test signals through the terminal contact, the contact, thesecond contact, and the anisotropic conductive polymer layer to thecomponent.
 68. The method of claim 67 wherein the substrate isconfigured to float in a Z-direction on the board.
 69. The method ofclaim 67 wherein the substrate comprises grooves on either side of thecontactor electrically isolating the contactor and forming a flexiblesegment on the substrate for the contactor.
 70. The method of claim 67wherein the terminal contact comprises an element selected from thegroup consisting of leads, bumps and pads.
 71. The method of claim 67wherein the component comprises an element selected from the groupconsisting of packages, BGA devices and modules.
 72. A method fortesting a semiconductor component having a plurality of terminalcontacts comprising: providing a board comprising a plurality ofcontacts in electrical communication with test circuitry; providing afloating substrate on the board; providing a plurality of testcontactors on the substrate, each test contactor comprising a flexiblesegment on the substrate, a first contact on a first side of theflexible segment configured to electrically engage a terminal contact, asecond contact and on a second opposing side of the flexible segment inelectrical communication with the first contact, and an anisotropicconductive polymer configured to electrically engage the second contactand a contact on the board; placing the component on the substrate withthe terminal contacts in electrical communication with the testcontactors; and applying test signals through the test contactors andthe terminal contacts to the component.
 73. The method of claim 72wherein the test contactors comprise an element selected from the groupconsisting of gold and platinum.
 74. The method of claim 72 wherein thefirst conductive polymer layer and the second conductive polymer layercomprise an elastomeric base material and a plurality of conductiveparticles in the base material.
 75. The method of claim 72 wherein theflexible segments allow the test contactors to move independently toaccommodate dimensional variations in the terminal contacts.
 76. Themethod of claim 72 wherein the placing step is performed using a testhandler.
 77. The method of claim 72 wherein the substrate comprises anopening and the board comprises a pin for physically engaging theopening.